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Crack propagation in silicon nitride ceramics under various temperatures and grain boundary toughness

Wei, S. / Porz, L. W. / Xie, Z. / Liu, B. / Chen, J. / Xue, W. / Zhao, J.

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Crack propagation in silicon nitride ceramics under various temperatures and grain boundary toughness

Wei, S. / Porz, L. W. / Xie, Z. / Liu, B. / Chen, J. / Xue, W. / Zhao, J.

Crack propagation in silicon nitride ceramics under various temperatures and grain boundary toughness

Wei, S. / Porz, L. W. / Xie, Z. / Liu, B. / Chen, J. / Xue, W. / Zhao, J.

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Check availability in my library

Order at Subito €

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Document information

Title:

Crack propagation in silicon nitride ceramics under various temperatures and grain boundary toughness

Contributors:

Wei, S. (author) / Porz, L. W. (author) / Xie, Z. (author) / Liu, B. (author) / Chen, J. (author) / Xue, W. (author) / Zhao, J. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 632 ; 58-61

Publication date:

2015-01-01

Size:

4 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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