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Coarse-grained molecular dynamics simulations of epoxy resin during the curing process

Fu, Y. / Michopoulos, J. / Song, J. H.

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Coarse-grained molecular dynamics simulations of epoxy resin during the curing process

Fu, Y. / Michopoulos, J. / Song, J. H.

Coarse-grained molecular dynamics simulations of epoxy resin during the curing process

Fu, Y. / Michopoulos, J. / Song, J. H.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

Similar titles

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Document information

Title:

Coarse-grained molecular dynamics simulations of epoxy resin during the curing process

Contributors:

Fu, Y. (author) / Michopoulos, J. (author) / Song, J. H. (author)

Published in:

COMPUTATIONAL MATERIALS SCIENCE ; 107 ; 24-32

Publication date:

2015-01-01

Size:

9 pages

ISSN:

0927-0256

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1 / 510

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