A platform for research: civil engineering, architecture and urbanism
Ternary intermetallic compounds in Au–Sn soldering systems—structure and properties
Ternary intermetallic compounds in Au–Sn soldering systems—structure and properties
Ternary intermetallic compounds in Au–Sn soldering systems—structure and properties
Müller, C. J. (author) / Bushlya, V. (author) / Ghasemi, M. (author) / Lidin, S. (author) / Valldor, M. (author) / Wang, F. (author)
JOURNAL OF MATERIALS SCIENCE ; 50 ; 7808-7820
2015-01-01
13 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Hydrogenation Properties of Ternary Intermetallic Compounds Mg~2~-~xPr~xNi~4
British Library Online Contents | 2012
|Ternary Intermetallic Compounds across the Mg-NiY Line at 673 K
British Library Online Contents | 2012
|Producing ternary intermetallic compounds powders by solid–liquid reaction ball milling
British Library Online Contents | 2010
|Fundamental Properties of Intermetallic Compounds
British Library Online Contents | 1995
|Impact properties of intermetallic compounds
British Library Online Contents | 1994
|