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Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures
Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures
Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures
Chen, H. (author) / Lee, H. Y. (author) / Ku, C. S. (author) / Wu, A. T. (author)
JOURNAL OF MATERIALS SCIENCE ; 51 ; 3600-3606
2016-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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