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    Effects of loading rate on development of pile-up during indentation creep of polycrystalline copper

    New search for: Chen, J.
    New search for: Shen, Y.
    New search for: Liu, W.
    New search for: Beake, B. D.
    New search for: Shi, X.
    New search for: Wang, Z.
    New search for: Zhang, Y.
    New search for: Guo, X.

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    Effects of loading rate on development of pile-up during indentation creep of polycrystalline copper

    New search for: Chen, J.
    New search for: Shen, Y.
    New search for: Liu, W.
    New search for: Beake, B. D.
    New search for: Shi, X.
    New search for: Wang, Z.
    New search for: Zhang, Y.
    New search for: Guo, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of loading rate on development of pile-up during indentation creep of polycrystalline copper

    New search for: Chen, J.
    New search for: Shen, Y.
    New search for: Liu, W.
    New search for: Beake, B. D.
    New search for: Shi, X.
    New search for: Wang, Z.
    New search for: Zhang, Y.
    New search for: Guo, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Effects of loading rate on development of pile-up during indentation creep of polycrystalline copper

    Contributors:

    Chen, J. (author) / Shen, Y. (author) / Liu, W. (author) / Beake, B. D. (author) / Shi, X. (author) / Wang, Z. (author) / Zhang, Y. (author) / Guo, X. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 656 ; 216-221

    Publication date:

    2016-01-01

    Size:

    6 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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