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Solder wetting behavior enhancement via laser-textured surface microcosmic topography

Chen, H. / Peng, J. / Fu, L. / Wang, X. / Xie, Y.

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Solder wetting behavior enhancement via laser-textured surface microcosmic topography

Chen, H. / Peng, J. / Fu, L. / Wang, X. / Xie, Y.

Solder wetting behavior enhancement via laser-textured surface microcosmic topography

Chen, H. / Peng, J. / Fu, L. / Wang, X. / Xie, Y.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Solder wetting behavior enhancement via laser-textured surface microcosmic topography

Contributors:

Chen, H. (author) / Peng, J. (author) / Fu, L. (author) / Wang, X. (author) / Xie, Y. (author)

Published in:

APPLIED SURFACE SCIENCE ; 368 ; 208-215

Publication date:

2016-01-01

Size:

8 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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