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    Sandwiched epoxy–alumina composites with synergistically enhanced thermal conductivity and breakdown strength

    New search for: Wang, Z.
    New search for: Cheng, Y.
    New search for: Wang, H.
    New search for: Yang, M.
    New search for: Shao, Y.
    New search for: Chen, X.
    New search for: Tanaka, T.

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    Sandwiched epoxy–alumina composites with synergistically enhanced thermal conductivity and breakdown strength

    New search for: Wang, Z.
    New search for: Cheng, Y.
    New search for: Wang, H.
    New search for: Yang, M.
    New search for: Shao, Y.
    New search for: Chen, X.
    New search for: Tanaka, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Sandwiched epoxy–alumina composites with synergistically enhanced thermal conductivity and breakdown strength

    New search for: Wang, Z.
    New search for: Cheng, Y.
    New search for: Wang, H.
    New search for: Yang, M.
    New search for: Shao, Y.
    New search for: Chen, X.
    New search for: Tanaka, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Sandwiched epoxy–alumina composites with synergistically enhanced thermal conductivity and breakdown strength

    Contributors:

    Wang, Z. (author) / Cheng, Y. (author) / Wang, H. (author) / Yang, M. (author) / Shao, Y. (author) / Chen, X. (author) / Tanaka, T. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 52 ; 4299-4308

    Publication date:

    2017-01-01

    Size:

    10 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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