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    Formation and growth of voids in dual-phase steel at microscale and nanoscale levels

    New search for: Gerstein, G.
    New search for: Besserer, H. B.
    New search for: Nürnberger, F.
    New search for: Barrales-Mora, L. A.
    New search for: Shvindlerman, L. S.
    New search for: Estrin, Y.
    New search for: Maier, H. J.

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    Formation and growth of voids in dual-phase steel at microscale and nanoscale levels

    New search for: Gerstein, G.
    New search for: Besserer, H. B.
    New search for: Nürnberger, F.
    New search for: Barrales-Mora, L. A.
    New search for: Shvindlerman, L. S.
    New search for: Estrin, Y.
    New search for: Maier, H. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Formation and growth of voids in dual-phase steel at microscale and nanoscale levels

    New search for: Gerstein, G.
    New search for: Besserer, H. B.
    New search for: Nürnberger, F.
    New search for: Barrales-Mora, L. A.
    New search for: Shvindlerman, L. S.
    New search for: Estrin, Y.
    New search for: Maier, H. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Formation and growth of voids in dual-phase steel at microscale and nanoscale levels

    Contributors:

    Gerstein, G. (author) / Besserer, H. B. (author) / Nürnberger, F. (author) / Barrales-Mora, L. A. (author) / Shvindlerman, L. S. (author) / Estrin, Y. (author) / Maier, H. J. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 52 ; 4234-4243

    Publication date:

    2017-01-01

    Size:

    10 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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