Atomistic molecular dynamics simulation study on thermomechanical properties of poly(1,3,5-trimethyl-1,3,5-trivinyl cyclotrisiloxane) dielectric insulator for soft electronics: Fid-Bau Portal

Atomistic molecular dynamics simulation study on thermomechanical properties of poly(1,3,5-trimethyl-1,3,5-trivinyl cyclotrisiloxane) dielectric insulator for soft electronics

Yang, S. / Yoon, S. / Kwon, S.

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Atomistic molecular dynamics simulation study on thermomechanical properties of poly(1,3,5-trimethyl-1,3,5-trivinyl cyclotrisiloxane) dielectric insulator for soft electronics

Yang, S. / Yoon, S. / Kwon, S.

Atomistic molecular dynamics simulation study on thermomechanical properties of poly(1,3,5-trimethyl-1,3,5-trivinyl cyclotrisiloxane) dielectric insulator for soft electronics

Yang, S. / Yoon, S. / Kwon, S.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Atomistic molecular dynamics simulation study on thermomechanical properties of poly(1,3,5-trimethyl-1,3,5-trivinyl cyclotrisiloxane) dielectric insulator for soft electronics

Contributors:

Yang, S. (author) / Yoon, S. (author) / Kwon, S. (author)

Published in:

JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY ; 32 ; 2183-2189

Publication date:

2018-01-01

Size:

7 pages

ISSN:

1738-494X

Type of media:

Article (Journal)