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    Effect of Complex Agents on Electroless Cu-plating on PCB with a Bath Containing Sodium Hypophosphite

    New search for: Shen, Xiaoni
    New search for: Lu, Yan
    New search for: Ren, Fengzhang
    New search for: Zhao, Dongmei
    New search for: Ji, Bibi
    New search for: Wang, Yongzhi

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    Effect of Complex Agents on Electroless Cu-plating on PCB with a Bath Containing Sodium Hypophosphite

    New search for: Shen, Xiaoni
    New search for: Lu, Yan
    New search for: Ren, Fengzhang
    New search for: Zhao, Dongmei
    New search for: Ji, Bibi
    New search for: Wang, Yongzhi

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Complex Agents on Electroless Cu-plating on PCB with a Bath Containing Sodium Hypophosphite

    New search for: Shen, Xiaoni
    New search for: Lu, Yan
    New search for: Ren, Fengzhang
    New search for: Zhao, Dongmei
    New search for: Ji, Bibi
    New search for: Wang, Yongzhi

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of Complex Agents on Electroless Cu-plating on PCB with a Bath Containing Sodium Hypophosphite

    Contributors:

    Shen, Xiaoni (author) / Lu, Yan (author) / Ren, Fengzhang (author) / Zhao, Dongmei (author) / Ji, Bibi (author) / Wang, Yongzhi (author)

    Published in:

    Fu shi ke xue yu fang hu ji shu = ; 27 ; 269-272

    Publication date:

    2015-01-01

    Size:

    4 pages

    ISSN:

    1002-6495

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.11223

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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