Influence of Additives in Acidic Copper Electroplating Bath on Nucleation Loop of Cyclic Voltammetric Curve: Fid-Bau Portal

Influence of Additives in Acidic Copper Electroplating Bath on Nucleation Loop of Cyclic Voltammetric Curve

Gu, Min / Wu, Ya-zhen

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Influence of Additives in Acidic Copper Electroplating Bath on Nucleation Loop of Cyclic Voltammetric Curve

Gu, Min / Wu, Ya-zhen

Influence of Additives in Acidic Copper Electroplating Bath on Nucleation Loop of Cyclic Voltammetric Curve

Gu, Min / Wu, Ya-zhen

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Influence of Additives in Acidic Copper Electroplating Bath on Nucleation Loop of Cyclic Voltammetric Curve

Contributors:

Gu, Min (author) / Wu, Ya-zhen (author)

Published in:

Cai liao bao hu = ; 49 ; 19-22

Publication date:

2016-01-01

Size:

4 pages

ISSN:

1001-1560

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.1

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