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    Effect of Solidification Conditions on the Deformation Behavior of Pure Copper Castings

    New search for: Goto, Ikuzo
    New search for: Aso, Setsuo
    New search for: Ohguchi, Ken-ichi
    New search for: Kurosawa, Kengo
    New search for: Suzuki, Hiroyuki
    New search for: Hayashi, Hiroyuki
    New search for: Shionoya, Jun-ichi

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    Effect of Solidification Conditions on the Deformation Behavior of Pure Copper Castings

    New search for: Goto, Ikuzo
    New search for: Aso, Setsuo
    New search for: Ohguchi, Ken-ichi
    New search for: Kurosawa, Kengo
    New search for: Suzuki, Hiroyuki
    New search for: Hayashi, Hiroyuki
    New search for: Shionoya, Jun-ichi

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Solidification Conditions on the Deformation Behavior of Pure Copper Castings

    New search for: Goto, Ikuzo
    New search for: Aso, Setsuo
    New search for: Ohguchi, Ken-ichi
    New search for: Kurosawa, Kengo
    New search for: Suzuki, Hiroyuki
    New search for: Hayashi, Hiroyuki
    New search for: Shionoya, Jun-ichi

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Effect of Solidification Conditions on the Deformation Behavior of Pure Copper Castings

    Contributors:

    Goto, Ikuzo (author) / Aso, Setsuo (author) / Ohguchi, Ken-ichi (author) / Kurosawa, Kengo (author) / Suzuki, Hiroyuki (author) / Hayashi, Hiroyuki (author) / Shionoya, Jun-ichi (author)

    Published in:

    Materials transactions ; 60 ; 2-9

    Publication date:

    2019-01-01

    Size:

    8 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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