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Transient Thermoelastic Analysis of a Solid Cylinder Containing a Circumferential Crack Using the C–V Heat Conduction Model
Transient Thermoelastic Analysis of a Solid Cylinder Containing a Circumferential Crack Using the C–V Heat Conduction Model
Transient Thermoelastic Analysis of a Solid Cylinder Containing a Circumferential Crack Using the C–V Heat Conduction Model
Fu, Jiawei (author) / Chen, Zengtao (author) / Qian, Linfang (author) / Hu, Keqiang (author)
Journal of thermal stresses ; 37 ; 1324-1345
2014-01-01
22 pages
Article (Journal)
English
DDC:
620.1121
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