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Molecular dynamics study on the thickness of damage layer in multiple grinding of monocrystalline silicon
Molecular dynamics study on the thickness of damage layer in multiple grinding of monocrystalline silicon
Molecular dynamics study on the thickness of damage layer in multiple grinding of monocrystalline silicon
Guo, Xiaoguang (author) / Li, Qiang (author) / Liu, Tao (author) / Zhai, Changheng (author) / Kang, Renke (author) / Jin, Zhuji (author)
Materials science in semiconductor processing ; 51 ; 15-19
2016-01-01
5 pages
Article (Journal)
English
DDC:
621.38152
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