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    Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys

    New search for: Li, Xuezheng
    New search for: Ma, Yong
    New search for: Zhou, Wei
    New search for: Wu, Ping

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    Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys

    New search for: Li, Xuezheng
    New search for: Ma, Yong
    New search for: Zhou, Wei
    New search for: Wu, Ping

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys

    New search for: Li, Xuezheng
    New search for: Ma, Yong
    New search for: Zhou, Wei
    New search for: Wu, Ping

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys

    Contributors:

    Li, Xuezheng (author) / Ma, Yong (author) / Zhou, Wei (author) / Wu, Ping (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 684 ; 328-334

    Publication date:

    2017-01-01

    Size:

    7 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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