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Thermally Induced Piezothermoelastic Fields of a Smart Sandwich Cylindrical Structure with a Functionally Graded Interlayer
Thermally Induced Piezothermoelastic Fields of a Smart Sandwich Cylindrical Structure with a Functionally Graded Interlayer
Thermally Induced Piezothermoelastic Fields of a Smart Sandwich Cylindrical Structure with a Functionally Graded Interlayer
Wang, H. M. (author)
Journal of thermal stresses ; 37 ; 585-603
2014-01-01
19 pages
Article (Journal)
English
DDC:
620.1121
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