Relief of residual stress of electrodeposited nickel by amine as additive in sulfamate electrolyte: Fid-Bau Portal

Relief of residual stress of electrodeposited nickel by amine as additive in sulfamate electrolyte

Lee, W.J. / Lee, S.J. / Kim, B.J. / Kim, H.C.

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Relief of residual stress of electrodeposited nickel by amine as additive in sulfamate electrolyte

Lee, W.J. / Lee, S.J. / Kim, B.J. / Kim, H.C.

Relief of residual stress of electrodeposited nickel by amine as additive in sulfamate electrolyte

Lee, W.J. / Lee, S.J. / Kim, B.J. / Kim, H.C.

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Document information

Title:

Relief of residual stress of electrodeposited nickel by amine as additive in sulfamate electrolyte

Contributors:

Lee, W.J. (author) / Lee, S.J. (author) / Kim, B.J. (author) / Kim, H.C. (author)

Published in:

MATERIALS LETTERS ; 198 ; 54-56

Publication date:

2017-01-01

Size:

3 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

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