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High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging
High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging
High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging
Cai, Zhiyong (author) / Zhang, Chun (author) / Wang, Richu (author) / Peng, Chaoqun (author) / Wu, Xiang (author) / Li, Haipu (author)
MATERIALS SCIENCE AND ENGINEERING A ; 728 ; 95-101
2018-01-01
7 pages
Article (Journal)
Unknown
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