Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Fracture strength of silicon wafers sawn by fixed diamond wire saw

    New search for: Liu, Tengyun
    New search for: Ge, Peiqi
    New search for: Bi, Wenbo
    New search for: Wang, Peizhi

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Fracture strength of silicon wafers sawn by fixed diamond wire saw

    New search for: Liu, Tengyun
    New search for: Ge, Peiqi
    New search for: Bi, Wenbo
    New search for: Wang, Peizhi

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Fracture strength of silicon wafers sawn by fixed diamond wire saw

    New search for: Liu, Tengyun
    New search for: Ge, Peiqi
    New search for: Bi, Wenbo
    New search for: Wang, Peizhi

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Fracture strength of silicon wafers sawn by fixed diamond wire saw

    Contributors:

    Liu, Tengyun (author) / Ge, Peiqi (author) / Bi, Wenbo (author) / Wang, Peizhi (author)

    Published in:

    Solar energy ; 157 ; 427-433

    Publication date:

    2017-01-01

    Size:

    7 pages

    ISSN:

    0038-092X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.47

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Fracture strength of silicon wafers sawn by fixed diamond wire saw

    Liu, Tengyun / Ge, Peiqi / Bi, Wenbo et al. | British Library Online Contents | 2017

    Prediction of the thickness for silicon wafers sawn by diamond wire saw

    Liu, Tengyun / Ge, Peiqi / Bi, Wenbo et al. | British Library Online Contents | 2017

    Prediction of the thickness for silicon wafers sawn by diamond wire saw

    Liu, Tengyun / Ge, Peiqi / Bi, Wenbo et al. | British Library Online Contents | 2017

    Ultrasonication pretreatment of diamond wire sawn multi-crystalline silicon wafers for texturing

    Zhang, Jinbing / Peng, Yeqing / Ye, Xingfang et al. | British Library Online Contents | 2018

    Prediction of the thickness for silicon wafers sawn by diamond wire saw

    Liu, Tengyun / Ge, Peiqi / Bi, Wenbo et al. | British Library Online Contents | 2017

    Back to top