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Reaction mechanisms of copper electrodeposition from 1-hydroxyethylidene-1, 1-diphosphonic acid (HEDP) solution on glassy carbon
Reaction mechanisms of copper electrodeposition from 1-hydroxyethylidene-1, 1-diphosphonic acid (HEDP) solution on glassy carbon
Reaction mechanisms of copper electrodeposition from 1-hydroxyethylidene-1, 1-diphosphonic acid (HEDP) solution on glassy carbon
Zheng, Jingwu (author) / Chen, Haibo (author) / Cai, Wei (author) / Qiao, Liang (author) / Ying, Yao (author) / Li, Wangchang (author) / Yu, Jing (author) / Jiang, Liqiang (author) / Che, Shenglei (author)
Materials science & engineering B ; 224 ; 18-27
2017-01-01
10 pages
Article (Journal)
Unknown
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