Evolution of microstructure and texture in copper during repetitive extrusion-upsetting and subsequent annealing: Fid-Bau Portal

Evolution of microstructure and texture in copper during repetitive extrusion-upsetting and subsequent annealing

Chen, Q. / Shu, D.Y. / Lin, J. / Wu, Y. / Xia, X.S. / Huang, S.H. / Zhao, Z.D. / Mishin, O.V. / Wu, G.L.

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Evolution of microstructure and texture in copper during repetitive extrusion-upsetting and subsequent annealing

Chen, Q. / Shu, D.Y. / Lin, J. / Wu, Y. / Xia, X.S. / Huang, S.H. / Zhao, Z.D. / Mishin, O.V. / Wu, G.L.

Evolution of microstructure and texture in copper during repetitive extrusion-upsetting and subsequent annealing

Chen, Q. / Shu, D.Y. / Lin, J. / Wu, Y. / Xia, X.S. / Huang, S.H. / Zhao, Z.D. / Mishin, O.V. / Wu, G.L.

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Title:

Evolution of microstructure and texture in copper during repetitive extrusion-upsetting and subsequent annealing

Contributors:

Chen, Q. (author) / Shu, D.Y. (author) / Lin, J. (author) / Wu, Y. (author) / Xia, X.S. (author) / Huang, S.H. (author) / Zhao, Z.D. (author) / Mishin, O.V. (author) / Wu, G.L. (author)

Published in:

Journal of materials science & technology ; 33 ; 690-697

Publication date:

2017-01-01

Size:

8 pages

ISSN:

1005-0302

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105

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