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Molecular dynamics simulation of melt structure evolution during cooling process for lead on nickel substrate surface

Guo, S. / Wang, M. / Zhao, P.J. / Wang, Q. / Du, K. / Lin, X. / Huang, W.D.

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Molecular dynamics simulation of melt structure evolution during cooling process for lead on nickel substrate surface

Guo, S. / Wang, M. / Zhao, P.J. / Wang, Q. / Du, K. / Lin, X. / Huang, W.D.

Molecular dynamics simulation of melt structure evolution during cooling process for lead on nickel substrate surface

Guo, S. / Wang, M. / Zhao, P.J. / Wang, Q. / Du, K. / Lin, X. / Huang, W.D.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Molecular dynamics simulation of melt structure evolution during cooling process for lead on nickel substrate surface

Contributors:

Guo, S. (author) / Wang, M. (author) / Zhao, P.J. (author) / Wang, Q. (author) / Du, K. (author) / Lin, X. (author) / Huang, W.D. (author)

Published in:

MATERIALS LETTERS ; 175 ; 20-22

Publication date:

2016-01-01

Size:

3 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

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