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Secondary creep stage behavior of copper-clad aluminum thin wires submitted to a moderate temperature level
Secondary creep stage behavior of copper-clad aluminum thin wires submitted to a moderate temperature level
Secondary creep stage behavior of copper-clad aluminum thin wires submitted to a moderate temperature level
Gueydan, Antoine (author) / Hug, Eric (author)
MATERIALS SCIENCE AND ENGINEERING A ; 709 ; 134-138
2018-01-01
5 pages
Article (Journal)
Unknown
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