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    Quantitative analysis of voids in multi-layer bonded structures based on transmitted laser ultrasonic waves

    New search for: Zhang, Kuanshuang
    New search for: Li, Shicheng
    New search for: Zhou, Zhenggan

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    Quantitative analysis of voids in multi-layer bonded structures based on transmitted laser ultrasonic waves

    New search for: Zhang, Kuanshuang
    New search for: Li, Shicheng
    New search for: Zhou, Zhenggan

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Quantitative analysis of voids in multi-layer bonded structures based on transmitted laser ultrasonic waves

    New search for: Zhang, Kuanshuang
    New search for: Li, Shicheng
    New search for: Zhou, Zhenggan

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Quantitative analysis of voids in multi-layer bonded structures based on transmitted laser ultrasonic waves

    Contributors:

    Zhang, Kuanshuang (author) / Li, Shicheng (author) / Zhou, Zhenggan (author)

    Published in:

    Archives of civil and mechanical engineering ; 19 ; 79-90

    Publication date:

    2019-01-01

    Size:

    12 pages

    ISSN:

    1644-9665

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  624

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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