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Copper foam enhanced Sn58Bi solder joint with high performance for low temperature packaging

Zhang, Hao / Sun, Fenglian / Liu, Yang

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Copper foam enhanced Sn58Bi solder joint with high performance for low temperature packaging

Zhang, Hao / Sun, Fenglian / Liu, Yang

Copper foam enhanced Sn58Bi solder joint with high performance for low temperature packaging

Zhang, Hao / Sun, Fenglian / Liu, Yang

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Copper foam enhanced Sn58Bi solder joint with high performance for low temperature packaging

Contributors:

Zhang, Hao (author) / Sun, Fenglian (author) / Liu, Yang (author)

Published in:

MATERIALS LETTERS ; 241 ; 108-110

Publication date:

2019-01-01

Size:

3 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

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