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    Modified electromechanical impedance-based disbond monitoring for honeycomb sandwich composite structure

    New search for: Zhu, Jianjian
    New search for: Wang, Yishou
    New search for: Qing, Xinlin

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    Modified electromechanical impedance-based disbond monitoring for honeycomb sandwich composite structure

    New search for: Zhu, Jianjian
    New search for: Wang, Yishou
    New search for: Qing, Xinlin

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Modified electromechanical impedance-based disbond monitoring for honeycomb sandwich composite structure

    New search for: Zhu, Jianjian
    New search for: Wang, Yishou
    New search for: Qing, Xinlin

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Modified electromechanical impedance-based disbond monitoring for honeycomb sandwich composite structure

    Contributors:

    Zhu, Jianjian (author) / Wang, Yishou (author) / Qing, Xinlin (author)

    Published in:

    Composite structures ; 217 ; 175-185

    Publication date:

    2019-01-01

    Size:

    11 pages

    ISSN:

    0263-8223

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  624.18

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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