A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Carbon nanotubes as heat dissipaters in microelectronics
arXiv:1309.6918 ; We review our recent modelling work of carbon nanotubes as potential candidates for heat dissipation in microelectronics cooling. In the first part, we analyze the impact of nanotube defects on their thermal transport properties. In the second part, we investigate the loss of thermal properties of nanotubes in presence of an interface with various substances, including air and water. Comparison with previous works is established whenever is possible. ; This work was financially supported by the European Union through the FP7 project “Thermal management with carbon nanotube architectures” (THEMA-CNT) under the contract number: 228539. We also thank the support from Spanish Grants FIS2011-65702-C02-01 & PIB2010US-00652, Proyecto Diputación Foral de Guipuzkoa (Exp. 29/12), and Grupo Consolidado UPV/EHU from Gobierno Vasco (IT- 319-07 & IT-578-13). We acknowledge financial support from the European Research Council Advanced Grant DYNamo (ERC-2010-AdG -Proposal Number 267374) and European Commission projects CRONOS (Grant No. 280879-2 CRONOS CP-FP7). JMGL has been supported by the Subprograma Ramón y Cajal, Dirección General de Investigación y Gestión del Plan Nacional de I+D, reference RYC-2011-07782, Spain. TM acknowledges support from the Danish Council for Independent Research, FTP Grants Nos. 11-104592 and 11-120938. ; Peer Reviewed
Carbon nanotubes as heat dissipaters in microelectronics
arXiv:1309.6918 ; We review our recent modelling work of carbon nanotubes as potential candidates for heat dissipation in microelectronics cooling. In the first part, we analyze the impact of nanotube defects on their thermal transport properties. In the second part, we investigate the loss of thermal properties of nanotubes in presence of an interface with various substances, including air and water. Comparison with previous works is established whenever is possible. ; This work was financially supported by the European Union through the FP7 project “Thermal management with carbon nanotube architectures” (THEMA-CNT) under the contract number: 228539. We also thank the support from Spanish Grants FIS2011-65702-C02-01 & PIB2010US-00652, Proyecto Diputación Foral de Guipuzkoa (Exp. 29/12), and Grupo Consolidado UPV/EHU from Gobierno Vasco (IT- 319-07 & IT-578-13). We acknowledge financial support from the European Research Council Advanced Grant DYNamo (ERC-2010-AdG -Proposal Number 267374) and European Commission projects CRONOS (Grant No. 280879-2 CRONOS CP-FP7). JMGL has been supported by the Subprograma Ramón y Cajal, Dirección General de Investigación y Gestión del Plan Nacional de I+D, reference RYC-2011-07782, Spain. TM acknowledges support from the Danish Council for Independent Research, FTP Grants Nos. 11-104592 and 11-120938. ; Peer Reviewed
Carbon nanotubes as heat dissipaters in microelectronics
Pérez Paz, Alejandro (author) / García-Lastra, J. M. (author) / Markussen, Troels (author) / Thygesen, Kristian S. (author) / Rubio, Angel (author) / Diputación Foral de Guipúzcoa / European Commission / Eusko Jaurlaritza / European Research Council / Danish Council for Strategic Research
2013-01-01
Article (Journal)
Electronic Resource
English
DDC:
690
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