A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Lightweight, soluble encapsulating compound permits repair of electronics
Jacketed microballoon encapsulant developed by Sippican Corp, Marion, Mass is described; core of encapsulant, glass microballoons with acetone as carrier and polyvinyl butyral as binder, is compound 2251-38-1; special epoxy material is used for encapsulant jacketing, to improve its moisture absorption and compressive strength characteristics.
Lightweight, soluble encapsulating compound permits repair of electronics
Jacketed microballoon encapsulant developed by Sippican Corp, Marion, Mass is described; core of encapsulant, glass microballoons with acetone as carrier and polyvinyl butyral as binder, is compound 2251-38-1; special epoxy material is used for encapsulant jacketing, to improve its moisture absorption and compressive strength characteristics.
Lightweight, soluble encapsulating compound permits repair of electronics
Insulation (Libertyville, Ill)
Steigerwald, R.M. (author)
1964
4 pages
Article (Journal)
English
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