A platform for research: civil engineering, architecture and urbanism
Subgrade and dump deformations caused by dumping of mine waste
Abstract The article presents a description of the toe-failure process of the waste dump formed at an open-cast mine. Field measurements and observations have shown that toe-failure is caused both by the occurence of plastic clays in the subgrade and the manner of dumping. Soil masses displaced from under the dump base form a zone of fold structures round the dump, which attains a maximum width of about 500 m and a height of about 15–20 m. Toe-failure generally expands from the dump towards the forefield at an average rate of 6–7 m/day. The deformation rate varies with time, which is due to successive shifting of the dump front. As a result of the toe-failure, landslides and dislocation systems arise in the heaped masses.
Subgrade and dump deformations caused by dumping of mine waste
Abstract The article presents a description of the toe-failure process of the waste dump formed at an open-cast mine. Field measurements and observations have shown that toe-failure is caused both by the occurence of plastic clays in the subgrade and the manner of dumping. Soil masses displaced from under the dump base form a zone of fold structures round the dump, which attains a maximum width of about 500 m and a height of about 15–20 m. Toe-failure generally expands from the dump towards the forefield at an average rate of 6–7 m/day. The deformation rate varies with time, which is due to successive shifting of the dump front. As a result of the toe-failure, landslides and dislocation systems arise in the heaped masses.
Subgrade and dump deformations caused by dumping of mine waste
Mularz, S. (author) / Rybicki, S. (author)
Engineering Geology ; 11 ; 189-200
1977-02-28
12 pages
Article (Journal)
Electronic Resource
English
Vibration response of the waste rock dump in open pit mine caused by blasting operation
DOAJ | 2015
|Soil and stone uniform dumping device for highway subgrade engineering
European Patent Office | 2023
|