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Variable thermal loading analysis of polycrystalline copper
AbstractAll the mechanical properties are temperature dependent. The temperature response of properties of copper at high temperature is still not been thoroughly understood. The ability to perform nano-test measurements at elevated temperatures opens up significant new possibilities in nanotechnology. The experiments are performed with tailor made Berkovich tip of radius 100nm with temperatures of 265K, 388K, 348K, 473K and 623K to study the behaviour of polycrystalline copper at different temperatures. The complete elastic range is found. The onset of the first burst is measured. The onset of plastic deformation is noticed from the periodic bursts. The brittleness is noticed at negative temperatures. The strain hardening effects, softening effects, strain release effects and pile up are noticed. The new phenomena of material under the indenter bouncing back at the end of unloading were clearly noticed, due to the accumulation of high energy. It is noticed that there is significant drop in depth, hardness and elastic modulus with increasing temperature. It is also noted that the elastic recovery reduces at higher temperatures.
Variable thermal loading analysis of polycrystalline copper
AbstractAll the mechanical properties are temperature dependent. The temperature response of properties of copper at high temperature is still not been thoroughly understood. The ability to perform nano-test measurements at elevated temperatures opens up significant new possibilities in nanotechnology. The experiments are performed with tailor made Berkovich tip of radius 100nm with temperatures of 265K, 388K, 348K, 473K and 623K to study the behaviour of polycrystalline copper at different temperatures. The complete elastic range is found. The onset of the first burst is measured. The onset of plastic deformation is noticed from the periodic bursts. The brittleness is noticed at negative temperatures. The strain hardening effects, softening effects, strain release effects and pile up are noticed. The new phenomena of material under the indenter bouncing back at the end of unloading were clearly noticed, due to the accumulation of high energy. It is noticed that there is significant drop in depth, hardness and elastic modulus with increasing temperature. It is also noted that the elastic recovery reduces at higher temperatures.
Variable thermal loading analysis of polycrystalline copper
Murugavel, R. (author) / Ramesh, T. (author) / Prema, P. (author)
2008-05-06
7 pages
Article (Journal)
Electronic Resource
English
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