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    Multi-scale characterization of SAP impact on self-healing behavior in UHPC under varied crack widths and environments

    New search for: Yang, Zaixin
    New search for: Miao, Chengxiang
    New search for: Deng, Wenqin
    New search for: Liu, Duo
    New search for: Zhang, Jiandong
    New search for: Gu, Jiancheng

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    Multi-scale characterization of SAP impact on self-healing behavior in UHPC under varied crack widths and environments

    New search for: Yang, Zaixin
    New search for: Miao, Chengxiang
    New search for: Deng, Wenqin
    New search for: Liu, Duo
    New search for: Zhang, Jiandong
    New search for: Gu, Jiancheng

    Access

    Check access
    Check availability in my library
    Order at Subito €

    Multi-scale characterization of SAP impact on self-healing behavior in UHPC under varied crack widths and environments

    New search for: Yang, Zaixin
    New search for: Miao, Chengxiang
    New search for: Deng, Wenqin
    New search for: Liu, Duo
    New search for: Zhang, Jiandong
    New search for: Gu, Jiancheng

    Access

    Check access
    Check availability in my library
    Order at Subito €

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    Document information
    Title:

    Multi-scale characterization of SAP impact on self-healing behavior in UHPC under varied crack widths and environments

    Additional title:

    Construction and Building Materials

    Contributors:

    Yang, Zaixin (author) / Miao, Chengxiang (author) / Deng, Wenqin (author) / Liu, Duo (author) / Zhang, Jiandong (author) / Gu, Jiancheng (author)

    Published in:

    Construction and Building Materials ; 421 ; 135649

    Publication date:

    2024-03-01

    ISSN:

    0950-0618

    DOI:

    https://doi.org/10.1016/j.conbuildmat.2024.135649

    Type of media:

    Article (Journal)

    Type of material:

    Electronic Resource

    Language:

    English

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