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Nanostructure formation mechanism during in-situ consolidation of copper by room-temperature ball milling
Highlights Hollow spheres of Cu were produced with increasing diameter by milling time. After 70h of milling, the diameter of hollow spheres reached to ∼8mm. Its microstructure consisted of both elongated ultrafine together with nanometer level spherical grains. Continuous dynamic recrystallization was the dominant mechanism for the formation of nanosized grains. Evidences for discontinuous dynamic recrystallization were also found in some regions of the microstructure.
Abstract Bulk nanostructured Cu was prepared by in-situ consolidation through room temperature ball milling. The consolidated parts consist of hollow spheres having a diameter which increases with increasing the milling time. Microhardness maps reveal that the distribution of the hardness is relatively homogeneous after 2h of milling. After 34h the hardness is higher at the outer edge and decreases toward the inner edge and, finally, after 70h the distribution is uniform again. Electron microscopic results show that the microstructure after 70h of milling consists of two types of grains: elongated ultrafine grains with high density of defects and equiaxed nanosized grains produced by dynamic recrystallization. Continuous dynamic recrystallization is the dominant mechanism for the formation of the nanosized grains. Evidence for the occurrence of discontinuous dynamic recrystallization through twinning was also found in a few regions of the in-situ consolidated samples.
Nanostructure formation mechanism during in-situ consolidation of copper by room-temperature ball milling
Highlights Hollow spheres of Cu were produced with increasing diameter by milling time. After 70h of milling, the diameter of hollow spheres reached to ∼8mm. Its microstructure consisted of both elongated ultrafine together with nanometer level spherical grains. Continuous dynamic recrystallization was the dominant mechanism for the formation of nanosized grains. Evidences for discontinuous dynamic recrystallization were also found in some regions of the microstructure.
Abstract Bulk nanostructured Cu was prepared by in-situ consolidation through room temperature ball milling. The consolidated parts consist of hollow spheres having a diameter which increases with increasing the milling time. Microhardness maps reveal that the distribution of the hardness is relatively homogeneous after 2h of milling. After 34h the hardness is higher at the outer edge and decreases toward the inner edge and, finally, after 70h the distribution is uniform again. Electron microscopic results show that the microstructure after 70h of milling consists of two types of grains: elongated ultrafine grains with high density of defects and equiaxed nanosized grains produced by dynamic recrystallization. Continuous dynamic recrystallization is the dominant mechanism for the formation of the nanosized grains. Evidence for the occurrence of discontinuous dynamic recrystallization through twinning was also found in a few regions of the in-situ consolidated samples.
Nanostructure formation mechanism during in-situ consolidation of copper by room-temperature ball milling
Samadi Khoshkhoo, M. (author) / Scudino, S. (author) / Gemming, T. (author) / Thomas, J. (author) / Freudenberger, J. (author) / Zehetbauer, M. (author) / Koch, C.C. (author) / Eckert, J. (author)
2014-06-19
8 pages
Article (Journal)
Electronic Resource
English
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