A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Microstructures and thermal properties of A356/SiCp composites fabricated by liquid pressing method
Highlights ► A356/45vol.%SiCp composites was fabricated by liquid pressing method. ► The composites exhibited low CTE and high thermal conductivity. ► Thermal conductivity decrease with porosity, and the effect of pore was evaluated.
Abstract A356/45vol.%SiCp composites with a uniform distribution of SiC particles have been fabricated by a liquid pressing method. Increasing the melt temperature, holding time and pre-treatment of SiCp by thermal oxidation improves the soundness of composites for the liquid pressing method. The sound composites exhibited low coefficient of thermal expansion (8ppm/K) and high thermal conductivity (155W/mK). The measured values for coefficient of thermal expansion agree well with the predicted values based on Turner’s model irrespective of porosity. The measured values for thermal conductivity decrease with porosity, and the effect of pore on the thermal conductivity has been evaluated based on the modified Hasselman–Johnson model.
Microstructures and thermal properties of A356/SiCp composites fabricated by liquid pressing method
Highlights ► A356/45vol.%SiCp composites was fabricated by liquid pressing method. ► The composites exhibited low CTE and high thermal conductivity. ► Thermal conductivity decrease with porosity, and the effect of pore was evaluated.
Abstract A356/45vol.%SiCp composites with a uniform distribution of SiC particles have been fabricated by a liquid pressing method. Increasing the melt temperature, holding time and pre-treatment of SiCp by thermal oxidation improves the soundness of composites for the liquid pressing method. The sound composites exhibited low coefficient of thermal expansion (8ppm/K) and high thermal conductivity (155W/mK). The measured values for coefficient of thermal expansion agree well with the predicted values based on Turner’s model irrespective of porosity. The measured values for thermal conductivity decrease with porosity, and the effect of pore on the thermal conductivity has been evaluated based on the modified Hasselman–Johnson model.
Microstructures and thermal properties of A356/SiCp composites fabricated by liquid pressing method
Lee, Jung-Moo (author) / Lee, Sang-Kwan (author) / Hong, Sung-Jin (author) / Kwon, Yong-Nam (author)
2012-01-13
4 pages
Article (Journal)
Electronic Resource
English
Microstructures and thermal properties of A356/SiCp composites fabricated by liquid pressing method
| British Library Online Contents | 2012
Interface structure changes during vibration liquid phase bonding of SiCp/A356 composites in air
| British Library Online Contents | 2006
Thermal expansion behavior and performance of VLP diffusion-bonded joints of SiCp/A356 composites
| British Library Online Contents | 2005
| British Library Online Contents | 2017
Simulation of mold filling under counter gravity for A356 alloy and A356/SiCp composite
| British Library Online Contents | 2009