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AbstractThe uniaxial tensile inelastic deformation behavior for three types of lead-free solders, Sn–3Ag–0.5Cu, Sn–3.5Ag and Sn–0.7Cu, were simulated by a unified viscoplastic constitutive model, the Anand model. To obtain the material parameters for the Anand model, a series of constant true strain rate and temperature tests were conducted on three types of lead-free solders at various strain rates from 1×10−4s−1 to 1×10−2s−1, over a wide temperature range from 25°C to 150°C. A modified Anand model, in which h0 was set to a function of strain rate, was proposed. The comparison of the experimental and simulated results showed that the modified Anand model improved the simulation capability.
AbstractThe uniaxial tensile inelastic deformation behavior for three types of lead-free solders, Sn–3Ag–0.5Cu, Sn–3.5Ag and Sn–0.7Cu, were simulated by a unified viscoplastic constitutive model, the Anand model. To obtain the material parameters for the Anand model, a series of constant true strain rate and temperature tests were conducted on three types of lead-free solders at various strain rates from 1×10−4s−1 to 1×10−2s−1, over a wide temperature range from 25°C to 150°C. A modified Anand model, in which h0 was set to a function of strain rate, was proposed. The comparison of the experimental and simulated results showed that the modified Anand model improved the simulation capability.
Simulation of uniaxial tensile properties for lead-free solders with modified Anand model
2008-04-16
7 pages
Article (Journal)
Electronic Resource
English
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