A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Abstract An improved jointing compound for the formation of a joint between adjacent, in situ panels of building material is disclosed. The improved jointing compound is a topping compound of the setting-type, comprising 30 - 47 wt. % of a mineral binder, 45 5 - 65 wt. % of a filler material and 1 - 3 wt.% of an organic binder. The filler material may include at least two different filler materials, such as one or more mineral filler materials and a lightweight filler material. The topping compound is lightweight, with low shrinkage and provides good spread-ability, high sand-ability and a smooth surface finish once applied and sanded. 7110961_1 (GHMatters) P97042.AU.1 SAMANTHA 11/11/15
Abstract An improved jointing compound for the formation of a joint between adjacent, in situ panels of building material is disclosed. The improved jointing compound is a topping compound of the setting-type, comprising 30 - 47 wt. % of a mineral binder, 45 5 - 65 wt. % of a filler material and 1 - 3 wt.% of an organic binder. The filler material may include at least two different filler materials, such as one or more mineral filler materials and a lightweight filler material. The topping compound is lightweight, with low shrinkage and provides good spread-ability, high sand-ability and a smooth surface finish once applied and sanded. 7110961_1 (GHMatters) P97042.AU.1 SAMANTHA 11/11/15
Jointing Compound
JAVED ADNAN (author)
2020-02-06
Patent
Electronic Resource
English