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Surface treatment method for inhibiting overplating of electronic ceramic element and electronic ceramic element
The invention discloses a surface treatment method for inhibiting the overplating of an electronic ceramic element and the electronic ceramic element. The surface treatment method comprises the following steps: S1, preparation of a surface treatment solution : uniformly mixing a material mixture with water to obtain a surface treatment solution, wherein the material mixture comprises Fe3(PO4)2, MnPO4, NaNO3, Y2O3, H3PO4, NaClO3 and Na2MoO4; S2, surface treatment: soaking the electronic ceramic element in the surface treatment solution, to generate a protective film on the surface of the electronic ceramic element; S3, cleaning and drying: cleaning residues on the surface of the electronic ceramic element treated in the step S2, and completely drying the electronic ceramic element; S4, sintering: performing surface sintering on the electronic ceramic element treated in the step S3. According to the surface treatment method provided by the invention, a high-resistivity protective film is formed on the surface of the electronic ceramic element product, so as to inhibit the overplating during electroplating.
Surface treatment method for inhibiting overplating of electronic ceramic element and electronic ceramic element
The invention discloses a surface treatment method for inhibiting the overplating of an electronic ceramic element and the electronic ceramic element. The surface treatment method comprises the following steps: S1, preparation of a surface treatment solution : uniformly mixing a material mixture with water to obtain a surface treatment solution, wherein the material mixture comprises Fe3(PO4)2, MnPO4, NaNO3, Y2O3, H3PO4, NaClO3 and Na2MoO4; S2, surface treatment: soaking the electronic ceramic element in the surface treatment solution, to generate a protective film on the surface of the electronic ceramic element; S3, cleaning and drying: cleaning residues on the surface of the electronic ceramic element treated in the step S2, and completely drying the electronic ceramic element; S4, sintering: performing surface sintering on the electronic ceramic element treated in the step S3. According to the surface treatment method provided by the invention, a high-resistivity protective film is formed on the surface of the electronic ceramic element product, so as to inhibit the overplating during electroplating.
Surface treatment method for inhibiting overplating of electronic ceramic element and electronic ceramic element
CHENG XUEJUN (author) / WANG QINGHUA (author)
2015-07-22
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
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