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Method for preparing multilayer device from ceramic/ resin composite
The invention discloses a method for preparing a multilayer device from a ceramic/ resin composite, relates to methods for preparing multilayer devices and solves the problems that in conventional LTCC technologies, the sintering temperature is high, the shrinking percentage is hard to control, and metal electrodes are easy to generate interface reaction with ceramics and are high in brittleness. The method comprises the following steps: I, preparing a turbid liquid; II, preparing sizing agent; III, defoaming the sizing agent, and carrying out tape casting to obtain a raw ceramic belt; IV, cutting the raw ceramic belt, printing conductive silver paste as circuits through the method of silk-screen printing, overlying, and carrying out rubber discharging to obtain a porous perform of microwave dielectric ceramics; V, dipping resin in the porous perform, solidifying and demoulding. The method is low in technological temperature, and the composite has no shrinkage in the preparation process, so that the interface reaction and diffusion between the conductive electrodes in the circuits and ceramics in the LTCC cofiring process are avoided; the prepared multilayer device is relatively high in dielectric constant, relatively low in dielectric loss, high in toughness and good in processability.
Method for preparing multilayer device from ceramic/ resin composite
The invention discloses a method for preparing a multilayer device from a ceramic/ resin composite, relates to methods for preparing multilayer devices and solves the problems that in conventional LTCC technologies, the sintering temperature is high, the shrinking percentage is hard to control, and metal electrodes are easy to generate interface reaction with ceramics and are high in brittleness. The method comprises the following steps: I, preparing a turbid liquid; II, preparing sizing agent; III, defoaming the sizing agent, and carrying out tape casting to obtain a raw ceramic belt; IV, cutting the raw ceramic belt, printing conductive silver paste as circuits through the method of silk-screen printing, overlying, and carrying out rubber discharging to obtain a porous perform of microwave dielectric ceramics; V, dipping resin in the porous perform, solidifying and demoulding. The method is low in technological temperature, and the composite has no shrinkage in the preparation process, so that the interface reaction and diffusion between the conductive electrodes in the circuits and ceramics in the LTCC cofiring process are avoided; the prepared multilayer device is relatively high in dielectric constant, relatively low in dielectric loss, high in toughness and good in processability.
Method for preparing multilayer device from ceramic/ resin composite
YE FENG (author) / ZHANG BIAO (author) / LIU SHICHAO (author) / GAO YE (author) / LIU QIANG (author) / MA JIE (author) / DING JUNJIE (author) / JIN YICHENG (author)
2015-09-30
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
Method for preparing ceramic/resin piezoelectric compound
| European Patent Office | 2016
European Patent Office | 2019