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The invention relates to an inorganic heat insulation fireproof board, which consists of a protection board, a base board and a built-in sandwich, wherein the sandwich comprises the following ingredients in percentage by weight: 8 percent to 15 percent of magnesium chlorides, 5 percent to 10 percent of magnesium oxides, 10 percent to 20 percent of expanded and vitrified micro beads, 3 percent to 6 percent of calc silicates, 10 percent to 18 percent of high-alumina cement, 0.05 percent to 0.1 percent of organic silicon water repellents, 0.1 percent to 0.25 percent of polypropylene fiber, 2 percent to 4 percent of bonding agents and 40 percent to 45 percent of water. After the technical scheme is adopted, the viscosity of wet mixtures is improved; the crushing of lightweight aggregates in products is effectively reduced; and the heat insulation performance of the products is greatly improved.
The invention relates to an inorganic heat insulation fireproof board, which consists of a protection board, a base board and a built-in sandwich, wherein the sandwich comprises the following ingredients in percentage by weight: 8 percent to 15 percent of magnesium chlorides, 5 percent to 10 percent of magnesium oxides, 10 percent to 20 percent of expanded and vitrified micro beads, 3 percent to 6 percent of calc silicates, 10 percent to 18 percent of high-alumina cement, 0.05 percent to 0.1 percent of organic silicon water repellents, 0.1 percent to 0.25 percent of polypropylene fiber, 2 percent to 4 percent of bonding agents and 40 percent to 45 percent of water. After the technical scheme is adopted, the viscosity of wet mixtures is improved; the crushing of lightweight aggregates in products is effectively reduced; and the heat insulation performance of the products is greatly improved.
Inorganic heat insulation fireproof board
GE TINGHONG (author)
2015-10-14
Patent
Electronic Resource
English
European Patent Office | 2021
|Fabricated inorganic diatom composite fireproof heat insulation board and preparation method
European Patent Office | 2021
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