A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Provided is a heat-conductive type silicon carbide aluminized composite material. A preparation method of the heat-conductive type silicon carbide aluminized composite material comprises the steps that 1, composite aluminum liquid is melted to be in a liquid state; 2, vacuumizing is conducted, the composite aluminum liquid is infiltrated on a silicon carbide substrate simultaneously, the vacuum degree ranges from -0.5 MPa to -0.8 MPa, heating is conducted simultaneously, the heating temperature ranges from 650 DEG C to 700 DEG C, aluminizing is maintained for 6-8 min, and the thickness ratio of the silicon carbide substrate to the infiltrated composite aluminum liquid is 10-13 to 1; 3, after the composite aluminum liquid is completely infiltrated, pressure relief is rapidly conducted, and then nitrogen or helium is fed, the silicon carbide material which is infiltrated with the composite aluminum liquid is pressurized to 0.5-0.8 MPa, and the pressurization time is 6-8 min; 4, after pressurization is completed, rapid cooling is conducted, natural cooling is conducted when the temperature is smaller than 600 DEG C, and a plate is obtained. The prepared plate has the advantages of being small in density, high in strength, high in hard wear resistance, resistant to corrosion and long in service life.
Provided is a heat-conductive type silicon carbide aluminized composite material. A preparation method of the heat-conductive type silicon carbide aluminized composite material comprises the steps that 1, composite aluminum liquid is melted to be in a liquid state; 2, vacuumizing is conducted, the composite aluminum liquid is infiltrated on a silicon carbide substrate simultaneously, the vacuum degree ranges from -0.5 MPa to -0.8 MPa, heating is conducted simultaneously, the heating temperature ranges from 650 DEG C to 700 DEG C, aluminizing is maintained for 6-8 min, and the thickness ratio of the silicon carbide substrate to the infiltrated composite aluminum liquid is 10-13 to 1; 3, after the composite aluminum liquid is completely infiltrated, pressure relief is rapidly conducted, and then nitrogen or helium is fed, the silicon carbide material which is infiltrated with the composite aluminum liquid is pressurized to 0.5-0.8 MPa, and the pressurization time is 6-8 min; 4, after pressurization is completed, rapid cooling is conducted, natural cooling is conducted when the temperature is smaller than 600 DEG C, and a plate is obtained. The prepared plate has the advantages of being small in density, high in strength, high in hard wear resistance, resistant to corrosion and long in service life.
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| European Patent Office | 2024
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| European Patent Office | 2017