A platform for research: civil engineering, architecture and urbanism
HEAT SHIELD COMPONENT AND MANUFACTURING METHOD THEREOF
A heat shield component (100) is provided with a substrate (10), and a ceramic porous layer (20) which comprises a ceramic-containing base body (21) arranged on the substrate (10), and pores (26) contained in the base body (21). The inner wall of the pores (26) is covered with a thermoplastic resin (28), and the porosity of the ceramic porous layer (20) is 40-70%. In this way, the provided heat shield component (100) has excellent heat insulation properties.
隔热部件(100)具备:基材(10);和陶瓷多孔层(20),其配置于基材(10)上,且含有包含陶瓷的基体(21)、和基体(21)中含有的气孔(26),气孔(26)的内壁由热塑性树脂(28)所覆盖,陶瓷多孔层(20)的气孔率为40%~70%。因此,根据这样的隔热部件(100),可以提供具有优异的绝热性的隔热部件。
HEAT SHIELD COMPONENT AND MANUFACTURING METHOD THEREOF
A heat shield component (100) is provided with a substrate (10), and a ceramic porous layer (20) which comprises a ceramic-containing base body (21) arranged on the substrate (10), and pores (26) contained in the base body (21). The inner wall of the pores (26) is covered with a thermoplastic resin (28), and the porosity of the ceramic porous layer (20) is 40-70%. In this way, the provided heat shield component (100) has excellent heat insulation properties.
隔热部件(100)具备:基材(10);和陶瓷多孔层(20),其配置于基材(10)上,且含有包含陶瓷的基体(21)、和基体(21)中含有的气孔(26),气孔(26)的内壁由热塑性树脂(28)所覆盖,陶瓷多孔层(20)的气孔率为40%~70%。因此,根据这样的隔热部件(100),可以提供具有优异的绝热性的隔热部件。
HEAT SHIELD COMPONENT AND MANUFACTURING METHOD THEREOF
隔热部件和其制造方法
SUZUKI YUKA (author) / MABUCHI YUTAKA (author)
2020-04-10
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME