A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Machining process for superfine-nanometer sectional material for preparing tool
The invention provides a machining process for a superfine-nanometer sectional material for preparing a tool. The machining process for the superfine-nanometer sectional material for preparing the tool comprises the following steps: S1, filling is carried out, that is, a first die assembly is provided, the first die assembly comprises a die outer sleeve, a plurality of filling holes penetrating through up and down are formed in the die outer sleeve, micro-nano tungsten carbide granulation materials or micro-nano tungsten boride granulation materials are filled into the filling holes of the dieouter sleeve, a first plug head and a second plug head are plugged into the upper end and the lower end of each filling hole separately, the grain size of the micro-nano tungsten carbide granulationmaterials or the micro-nano tungsten boride granulation materials is 50-150nm, and each filling hole is cylindrical, and has a radius of 100-350mm and a height of 500-1500mm; S2, first cold isostaticpressing is carried out; S3, second cold isostatic pressing is carried out; and S4, the pressed-formed secondary blank is sintered, and the superfine-nanometer sectional material for preparing the tool is obtained.
本发明提供一种用于制备刀具的超微纳米型材的加工工艺，包括以下步骤：S1、填料：提供第一套模具组件，所述的第一套模具组件包括模具外套，所述的模具外套中设置有多个上下贯通的填料孔，将微纳米碳化钨或微纳米硼化钨造粒料装入所述模具外套的填料孔，在填料孔的上下两端分别塞入第一塞头和第二塞头，微纳米碳化钨或微纳米硼化钨造粒料的晶粒度：50～150nm。所述的填料孔为圆柱形，半径为100～350mm，高为500～1500mm。S2、第一次冷等静压压制，S3、第二次冷等静压压制；S4、将压制成型的第二次料胚进行烧结，获得用于制备刀具的超微纳米型材。
Machining process for superfine-nanometer sectional material for preparing tool
The invention provides a machining process for a superfine-nanometer sectional material for preparing a tool. The machining process for the superfine-nanometer sectional material for preparing the tool comprises the following steps: S1, filling is carried out, that is, a first die assembly is provided, the first die assembly comprises a die outer sleeve, a plurality of filling holes penetrating through up and down are formed in the die outer sleeve, micro-nano tungsten carbide granulation materials or micro-nano tungsten boride granulation materials are filled into the filling holes of the dieouter sleeve, a first plug head and a second plug head are plugged into the upper end and the lower end of each filling hole separately, the grain size of the micro-nano tungsten carbide granulationmaterials or the micro-nano tungsten boride granulation materials is 50-150nm, and each filling hole is cylindrical, and has a radius of 100-350mm and a height of 500-1500mm; S2, first cold isostaticpressing is carried out; S3, second cold isostatic pressing is carried out; and S4, the pressed-formed secondary blank is sintered, and the superfine-nanometer sectional material for preparing the tool is obtained.
本发明提供一种用于制备刀具的超微纳米型材的加工工艺，包括以下步骤：S1、填料：提供第一套模具组件，所述的第一套模具组件包括模具外套，所述的模具外套中设置有多个上下贯通的填料孔，将微纳米碳化钨或微纳米硼化钨造粒料装入所述模具外套的填料孔，在填料孔的上下两端分别塞入第一塞头和第二塞头，微纳米碳化钨或微纳米硼化钨造粒料的晶粒度：50～150nm。所述的填料孔为圆柱形，半径为100～350mm，高为500～1500mm。S2、第一次冷等静压压制，S3、第二次冷等静压压制；S4、将压制成型的第二次料胚进行烧结，获得用于制备刀具的超微纳米型材。
Machining process for superfine-nanometer sectional material for preparing tool
一种用于制备刀具的超微纳米型材的加工工艺
SI QIONG (author) / ZHANG TIEBANG (author) / LI JIA (author) / CHEN SONG (author) / WU WANRONG (author) / JIN YONG (author) / HU PEI (author)
2020-06-19
Patent
Electronic Resource
Chinese
TECHNICAL DEVICE FOR PREPARING SUPERFINE POWDER FOR POTTERY
| European Patent Office | 2019
Method for preparing in-situ synthesis superfine layered TiCx reinforced SiC composite material
| European Patent Office | 2024
| European Patent Office | 2022
Thermosensitive material for superfine continuous thermocouple
| European Patent Office | 2024
Processing method for preparing concrete admixture from superfine slag powder
| European Patent Office | 2021