A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
TEMPORARILY BONDED BODY COMPOSED OF CERAMIC RESIN COMPLEX AND METAL PLATE AND METHOD FOR MANUFACTURING SAME, AND TRANSPORTER COMPRISING SAID TEMPORARILY BONDED BODY AND DELIVERY METHOD USING SAME
The purpose of the present invention is to make the breakage or deterioration of a poor-strength ceramic resin complex unlikely to occur. A ceramic-metal temporality bonded body comprising a ceramic resin complex and a metal plate that is temporality bonded to at least one surface of the ceramic resin complex, wherein the ceramic resin complex is produced by impregnating a non-oxide ceramic sintered body with a heat-curable resin composition having a cyanate group so that the non-oxide ceramic sintered body can have a curing rate of 5.0 to 70% inclusive as calculated with a differential scanning calorimeter, and the shear bond strength between the ceramic resin complex and the metal plate is 0.1 to 1.0 MPa inclusive.
使强度低的陶瓷树脂复合体不易发生破损·劣化。陶瓷金属临时粘接体，其包含：以使得由差示扫描量热计计算出的固化率成为5.0％以上且70％以下的方式使具有氰酸酯基的热固性树脂组合物含浸于非氧化物陶瓷烧结体而成的陶瓷树脂复合体；和处于临时粘接于该陶瓷树脂复合体的至少一个面的状态的金属板，前述陶瓷树脂复合体与前述金属板的剪切粘接强度为0.1MPa以上且1.0MPa以下。
TEMPORARILY BONDED BODY COMPOSED OF CERAMIC RESIN COMPLEX AND METAL PLATE AND METHOD FOR MANUFACTURING SAME, AND TRANSPORTER COMPRISING SAID TEMPORARILY BONDED BODY AND DELIVERY METHOD USING SAME
The purpose of the present invention is to make the breakage or deterioration of a poor-strength ceramic resin complex unlikely to occur. A ceramic-metal temporality bonded body comprising a ceramic resin complex and a metal plate that is temporality bonded to at least one surface of the ceramic resin complex, wherein the ceramic resin complex is produced by impregnating a non-oxide ceramic sintered body with a heat-curable resin composition having a cyanate group so that the non-oxide ceramic sintered body can have a curing rate of 5.0 to 70% inclusive as calculated with a differential scanning calorimeter, and the shear bond strength between the ceramic resin complex and the metal plate is 0.1 to 1.0 MPa inclusive.
使强度低的陶瓷树脂复合体不易发生破损·劣化。陶瓷金属临时粘接体，其包含：以使得由差示扫描量热计计算出的固化率成为5.0％以上且70％以下的方式使具有氰酸酯基的热固性树脂组合物含浸于非氧化物陶瓷烧结体而成的陶瓷树脂复合体；和处于临时粘接于该陶瓷树脂复合体的至少一个面的状态的金属板，前述陶瓷树脂复合体与前述金属板的剪切粘接强度为0.1MPa以上且1.0MPa以下。
TEMPORARILY BONDED BODY COMPOSED OF CERAMIC RESIN COMPLEX AND METAL PLATE AND METHOD FOR MANUFACTURING SAME, AND TRANSPORTER COMPRISING SAID TEMPORARILY BONDED BODY AND DELIVERY METHOD USING SAME
陶瓷树脂复合体与金属板的临时粘接体、其制造方法、包含该临时粘接体的运输体、及其运输方法
MINAKATA YOSHITAKA (author) / YAMAGATA TOSHITAKA (author) / INOUE SAORI (author) / YOSHIMATU RYO (author) / KOGA RYUJI (author)
2020-06-30
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
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SINTERED BODY, SINTERED BODY MANUFACTURING METHOD, POWDER, AND TEMPORARILY SINTERED BODY
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