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Packaging method based on nano metal
The invention discloses a packaging method based on nano metal. The method comprises the following steps: S1, sintering a layer of a metal wire along the periphery of a working surface of a ceramic base, S2, adding a nano metal layer along the metal wire, S3, arranging a packaged object in an area surrounded by the metal wire on the working surface, S4, placing a metal cap on the nano metal layer,and S5, taking the metal wire and the nano metal layer as welding materials, welding the working surface and the edge of an opening of the metal cap to form a closed cavity, and enabling the packagedobject to be located in the closed cavity.
一种基于纳米金属的封装方法，包括：S1、沿陶瓷基座的工作面周边，烧结一层金属线；S2、沿所述金属线，添加一层纳米金属层；S3、在所述工作面上所述金属线所包围的区域内，设置封装对象；S4、在所述纳米金属层上放置金属帽盖；S5、以所述金属线和所述纳米金属层作为焊接材料，焊接所述工作面与所述金属帽盖的开口边缘，形成密闭空腔，所述封装对象位于所述密闭空腔内。
Packaging method based on nano metal
The invention discloses a packaging method based on nano metal. The method comprises the following steps: S1, sintering a layer of a metal wire along the periphery of a working surface of a ceramic base, S2, adding a nano metal layer along the metal wire, S3, arranging a packaged object in an area surrounded by the metal wire on the working surface, S4, placing a metal cap on the nano metal layer,and S5, taking the metal wire and the nano metal layer as welding materials, welding the working surface and the edge of an opening of the metal cap to form a closed cavity, and enabling the packagedobject to be located in the closed cavity.
一种基于纳米金属的封装方法，包括：S1、沿陶瓷基座的工作面周边，烧结一层金属线；S2、沿所述金属线，添加一层纳米金属层；S3、在所述工作面上所述金属线所包围的区域内，设置封装对象；S4、在所述纳米金属层上放置金属帽盖；S5、以所述金属线和所述纳米金属层作为焊接材料，焊接所述工作面与所述金属帽盖的开口边缘，形成密闭空腔，所述封装对象位于所述密闭空腔内。
Packaging method based on nano metal
一种基于纳米金属的封装方法
LI JINXIONG (author) / ZHU YONG'AN (author) / ZENG TANTONG (author)
2020-07-03
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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