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High-heat-dissipation mobile phone 3D rear cover protection material and preparation method thereof
The invention discloses a high-heat-dissipation 3D rear cover protection material for a mobile phone. The MgAl2O4 microwave dielectric ceramic is prepared from the following components in percentage by weight: 5-10% of MgAl2O4, 28-30% of MgO.Al2O3.SiO2, 5-8% of SiO2.MgO.B2O3, 7-8% SnO.P2O5, 6%-7.5% of SiO2.B2O3.ZnO, 19%-21% of SiO2.R2O.TiO2, 2%-3% of 2Li2O.SiO2, 14%-15% of Na2O.2SiO2, 1%-2% of Bi2O3.B2O3, 2.5%-4.5% of SiC and 0.8%-2% of graphite. By means of low-temperature hot-pressing sintering, a large number of ceramic crystals are introduced, expansion of microcracks during falling is blocked, alkali metal ions are introduced into a low-temperature sintered body for chemical strengthening, and the falling resistance of the material is effectively improved in combination with a high-strength glass body; meanwhile, a part of high-heat-conductivity ceramic crystals are introduced to form a heat conduction path and heat conduction network connection with graphite, so that the overallheat dissipation performance is greatly improved.
高散热手机3D后盖保护材料，按重量百分比其组分为5‑10％MgAlO，28‑30％MgO·AlO·SiO，5‑8％SiO·MgO·BO，7‑8％SnO·PO，6‑7.5％SiO·BO·ZnO，19‑21％SiO·RO·TiO，2‑3％2LiO·SiO，14‑15％NaO·2SiO，1‑2％BiO·BO，2.5‑4.5％SiC，0.8‑2％石墨；采用低温热压烧结，引入大量的陶瓷晶体，阻挡摔落时微裂纹的扩展，低温烧结体中引入碱金属离子，进行化学强化，结合高强玻璃本体，有效增加材料的抗摔性能；同时引入部分高导热系数陶瓷晶体与石墨形成导热路径和导热网联，整体散热性能获得较大提高。
High-heat-dissipation mobile phone 3D rear cover protection material and preparation method thereof
The invention discloses a high-heat-dissipation 3D rear cover protection material for a mobile phone. The MgAl2O4 microwave dielectric ceramic is prepared from the following components in percentage by weight: 5-10% of MgAl2O4, 28-30% of MgO.Al2O3.SiO2, 5-8% of SiO2.MgO.B2O3, 7-8% SnO.P2O5, 6%-7.5% of SiO2.B2O3.ZnO, 19%-21% of SiO2.R2O.TiO2, 2%-3% of 2Li2O.SiO2, 14%-15% of Na2O.2SiO2, 1%-2% of Bi2O3.B2O3, 2.5%-4.5% of SiC and 0.8%-2% of graphite. By means of low-temperature hot-pressing sintering, a large number of ceramic crystals are introduced, expansion of microcracks during falling is blocked, alkali metal ions are introduced into a low-temperature sintered body for chemical strengthening, and the falling resistance of the material is effectively improved in combination with a high-strength glass body; meanwhile, a part of high-heat-conductivity ceramic crystals are introduced to form a heat conduction path and heat conduction network connection with graphite, so that the overallheat dissipation performance is greatly improved.
高散热手机3D后盖保护材料，按重量百分比其组分为5‑10％MgAlO，28‑30％MgO·AlO·SiO，5‑8％SiO·MgO·BO，7‑8％SnO·PO，6‑7.5％SiO·BO·ZnO，19‑21％SiO·RO·TiO，2‑3％2LiO·SiO，14‑15％NaO·2SiO，1‑2％BiO·BO，2.5‑4.5％SiC，0.8‑2％石墨；采用低温热压烧结，引入大量的陶瓷晶体，阻挡摔落时微裂纹的扩展，低温烧结体中引入碱金属离子，进行化学强化，结合高强玻璃本体，有效增加材料的抗摔性能；同时引入部分高导热系数陶瓷晶体与石墨形成导热路径和导热网联，整体散热性能获得较大提高。
High-heat-dissipation mobile phone 3D rear cover protection material and preparation method thereof
高散热手机3D后盖保护材料及其制备方法
ZHANG FUJUN (author) / ZHOU WEIWEI (author)
2020-08-18
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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