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Preparation method of low-dielectric low-density quartzite ceramic material
The invention discloses a preparation method of a low-dielectric low-density quartzite ceramic material and belongs to the technical field of ceramic materials. A target material is prepared by takingquartz powder as a raw material, through an injection coagulation process and by means of organic matter pore forming, low-temperature glue discharging and high-temperature sintering. The preparationmethod is simple and convenient to operate; the performance of the product is stable, the dielectric coefficient of the product is low and can reach 2.0-2.8, the strength of the product reaches 20 MPa or above; and the difficulty existing in preparation of the low-dielectric low-density quartz ceramic is well solved. Most traditional low-dielectric materials are organic materials, the high temperature resistance of thematerials is very limited; the product prepared through the method is a ceramic material, the problem that organic low-dielectric materials cannot tolerate the high temperatureof 500 DEG C or above is well solved; and the application prospect of theproduct in the high-temperature low-dielectric field, especially the microwave communication field is very bright.
本发明公开了一种低介电低密度石英质陶瓷材料制备方法，属于陶瓷材料技术领域，以石英粉为原料，结合注凝工艺，采用有机物造孔、低温排胶、高温烧结制备得到目标材料。工艺操作简便，产品性能稳定，介电系数较低能够达到2.0～2.8，产品强度达到20MPa以上，很好地解决了低介电低密度石英陶瓷的制备存在的困难。传统低介电材料多为有机材料，耐高温性能非常有限，本专利提供方法制备产品为陶瓷质材料，很好的解决了有机低介电材料不能耐受500℃以上高温的问题，在高温低介电领域尤其是微波通信领域应用前景非常广阔。
Preparation method of low-dielectric low-density quartzite ceramic material
The invention discloses a preparation method of a low-dielectric low-density quartzite ceramic material and belongs to the technical field of ceramic materials. A target material is prepared by takingquartz powder as a raw material, through an injection coagulation process and by means of organic matter pore forming, low-temperature glue discharging and high-temperature sintering. The preparationmethod is simple and convenient to operate; the performance of the product is stable, the dielectric coefficient of the product is low and can reach 2.0-2.8, the strength of the product reaches 20 MPa or above; and the difficulty existing in preparation of the low-dielectric low-density quartz ceramic is well solved. Most traditional low-dielectric materials are organic materials, the high temperature resistance of thematerials is very limited; the product prepared through the method is a ceramic material, the problem that organic low-dielectric materials cannot tolerate the high temperatureof 500 DEG C or above is well solved; and the application prospect of theproduct in the high-temperature low-dielectric field, especially the microwave communication field is very bright.
本发明公开了一种低介电低密度石英质陶瓷材料制备方法，属于陶瓷材料技术领域，以石英粉为原料，结合注凝工艺，采用有机物造孔、低温排胶、高温烧结制备得到目标材料。工艺操作简便，产品性能稳定，介电系数较低能够达到2.0～2.8，产品强度达到20MPa以上，很好地解决了低介电低密度石英陶瓷的制备存在的困难。传统低介电材料多为有机材料，耐高温性能非常有限，本专利提供方法制备产品为陶瓷质材料，很好的解决了有机低介电材料不能耐受500℃以上高温的问题，在高温低介电领域尤其是微波通信领域应用前景非常广阔。
Preparation method of low-dielectric low-density quartzite ceramic material
一种低介电低密度石英质陶瓷材料制备方法
CAO JUNCHANG (author) / ZHU BAOXIN (author) / GE YING (author) / YANG XIANFENG (author) / WEI QIHONG (author) / XING ZHENGPENG (author) / WANG HONGSHENG (author) / LUAN QIANG (author) / JIANG LIPING (author) / CUI TANGYIN (author)
2021-03-09
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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