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High-thermal-conductivity high-strength heat dissipation substrate and preparation method thereof
The invention provides a high-thermal-conductivity high-strength heat dissipation substrate. The heat dissipation substrate is a PCBN composite sheet and is mainly formed by sintering AlN-coated CBN powder at high temperature and high pressure, wherein the AlN-coated CBN powder is composed of CBN micropowder and an AlN film coating the surface of the CBN micropowder. The invention further provides a preparation method of the high-thermal-conductivity high-strength heat dissipation substrate. In the high-thermal-conductivity high-strength heat dissipation substrate, the AlN film uniformly coats the surface of the CBN micropowder in the AlN-coated CBN powder, AlN and CBN are tightly combined, and interface thermal resistance between the AlN and the CBN is small after the PCBN is synthesized at high temperature and high pressure, so the thermal conductivity of the PCBN composite sheet reaches 300 W/(m.k) or above and the bending strength of the PCBN composite sheet reaches 600 MPa or above; and therefore, the PCBN composite sheet can be used as a material of the high-thermal-conductivity high-strength heat dissipation substrate.
本发明提供了一种高导热高强度散热基板，它为PCBN复合片，主要由CBN微粉和包覆在所述CBN微粉表面的AlN膜组成的AlN包覆的CBN粉体通过高温高压烧结而成。本发明还提供一种上述高导热高强度散热基板的制备方法。上述高导热高强度散热基板中，由于在所述AlN包覆的CBN粉体中，所述AlN膜均匀包覆在所述CBN微粉表面，同时AlN与CBN之间结合紧密，所述高温高压合成PCBN后AlN与CBN之间的界面热阻小，使得所述PCBN复合片的热导率达到300 W/(m·k)以上，且弯曲强度达到600 MPa以上，从而使得所述PCBN复合片成为一种高导热高强度散热基板的材料。
High-thermal-conductivity high-strength heat dissipation substrate and preparation method thereof
The invention provides a high-thermal-conductivity high-strength heat dissipation substrate. The heat dissipation substrate is a PCBN composite sheet and is mainly formed by sintering AlN-coated CBN powder at high temperature and high pressure, wherein the AlN-coated CBN powder is composed of CBN micropowder and an AlN film coating the surface of the CBN micropowder. The invention further provides a preparation method of the high-thermal-conductivity high-strength heat dissipation substrate. In the high-thermal-conductivity high-strength heat dissipation substrate, the AlN film uniformly coats the surface of the CBN micropowder in the AlN-coated CBN powder, AlN and CBN are tightly combined, and interface thermal resistance between the AlN and the CBN is small after the PCBN is synthesized at high temperature and high pressure, so the thermal conductivity of the PCBN composite sheet reaches 300 W/(m.k) or above and the bending strength of the PCBN composite sheet reaches 600 MPa or above; and therefore, the PCBN composite sheet can be used as a material of the high-thermal-conductivity high-strength heat dissipation substrate.
本发明提供了一种高导热高强度散热基板，它为PCBN复合片，主要由CBN微粉和包覆在所述CBN微粉表面的AlN膜组成的AlN包覆的CBN粉体通过高温高压烧结而成。本发明还提供一种上述高导热高强度散热基板的制备方法。上述高导热高强度散热基板中，由于在所述AlN包覆的CBN粉体中，所述AlN膜均匀包覆在所述CBN微粉表面，同时AlN与CBN之间结合紧密，所述高温高压合成PCBN后AlN与CBN之间的界面热阻小，使得所述PCBN复合片的热导率达到300 W/(m·k)以上，且弯曲强度达到600 MPa以上，从而使得所述PCBN复合片成为一种高导热高强度散热基板的材料。
High-thermal-conductivity high-strength heat dissipation substrate and preparation method thereof
高导热高强度散热基板及其制备方法
LI KANG (author) / LEI JUN (author) / WANG BINBIN (author) / HUANG HONGWEI (author)
2021-04-06
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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