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A platform for research: civil engineering, architecture and urbanism
Flame-retardant reed leaf sawdust board and preparation method thereof
The invention discloses a flame-retardant reed leaf wood chip board and a preparation method thereof. The flame-retardant reed leaf wood chip board comprises two layers of reed leaf panels and a layer of wood chip core board, wherein the wood chip board is sandwiched between the two layers of reed leaf panels, and is formed by bonding and extruding a specially-made environment-friendly adhesive. The method comprising the steps of two processes of manufacturing an environment-friendly adhesive and manufacturing a flame-retardant wood chip core board, and the manufacturing of the flame-retardant wood chip core board is divided into manufacturing of a reed leaf panel and manufacturing of the sawdust core board.
一种阻燃粽叶木屑板及其制备方法，有两层粽叶面板、一层木屑芯板。其中，木屑芯板被两层粽叶面板夹在在中间，通过特制的环保粘合剂粘合挤压而成。包括环保粘合剂的制作和阻燃粽叶木屑芯板制作、两项工序，阻燃粽叶木屑板制作又分为粽叶面板制作和木屑芯板制作。
Flame-retardant reed leaf sawdust board and preparation method thereof
The invention discloses a flame-retardant reed leaf wood chip board and a preparation method thereof. The flame-retardant reed leaf wood chip board comprises two layers of reed leaf panels and a layer of wood chip core board, wherein the wood chip board is sandwiched between the two layers of reed leaf panels, and is formed by bonding and extruding a specially-made environment-friendly adhesive. The method comprising the steps of two processes of manufacturing an environment-friendly adhesive and manufacturing a flame-retardant wood chip core board, and the manufacturing of the flame-retardant wood chip core board is divided into manufacturing of a reed leaf panel and manufacturing of the sawdust core board.
一种阻燃粽叶木屑板及其制备方法，有两层粽叶面板、一层木屑芯板。其中，木屑芯板被两层粽叶面板夹在在中间，通过特制的环保粘合剂粘合挤压而成。包括环保粘合剂的制作和阻燃粽叶木屑芯板制作、两项工序，阻燃粽叶木屑板制作又分为粽叶面板制作和木屑芯板制作。
Flame-retardant reed leaf sawdust board and preparation method thereof
一种阻燃粽叶木屑板及其制备方法
LONG JIANSHE (author)
2021-05-04
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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