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Preparation method of graphene film with ultrahigh thermal conductivity
The invention discloses a preparation method of a graphene film with ultrahigh thermal conductivity, the d preparation method comprises the following steps: firstly, assembling graphene oxide into a film, then carrying out thermal reduction on the film to remove non-carbon atoms, meanwhile, modifying the graphene oxide film by using a chemical vapor deposition technology in the thermal reduction process. On one hand, vapor deposition carbon atoms are used for repairing the defects of the graphite surface net, and on the other hand, the density of the graphene film is enhanced, that is, the graphene film with ultrahigh heat conductivity is obtained from the completeness of the volume density and the graphite crystal. According to the graphene film obtained by the method, the volume density is 1.8-2.2 g/cm < 3 >, and the thermal diffusion coefficient can reach 914.3-1071.5 mm < 2 >/s. Correspondingly, the thermal conductivity of the graphene in the plane direction can reach 1168.5-1637.7 W/mK. The graphene film obtained by the method has fewer pores and high compactness, so that the graphene film has higher thermal conductivity. The graphene film can be used in the fields of transverse temperature equalization of electronic equipment.
本发明公开了一种超高导热石墨烯膜的制备方法，首先将氧化石墨烯组装成膜，然后将其热还原移除非碳原子，与此同时，在热还原的过程中，同步使用化学气相沉积技术对氧化石墨烯膜进行改性，一方面利用气相沉积的碳原子修补石墨面网的缺陷，另一方面增强石墨烯膜的密度。即从体积密度和石墨晶体的完善性着手，进而获得超高导热石墨烯膜。本方法所得的石墨烯膜，体积密度为1.8～2.2g/cm3，热扩散系数则可达914.3～1071.5mm2/s。相应地，石墨烯平面方向上热导率可达1168.5～1637.7W/mK。本发明所得的石墨烯薄膜的孔隙较少，致密性高，因此具有较高的热导率。可用于电子设备的横向均温等领域。
Preparation method of graphene film with ultrahigh thermal conductivity
The invention discloses a preparation method of a graphene film with ultrahigh thermal conductivity, the d preparation method comprises the following steps: firstly, assembling graphene oxide into a film, then carrying out thermal reduction on the film to remove non-carbon atoms, meanwhile, modifying the graphene oxide film by using a chemical vapor deposition technology in the thermal reduction process. On one hand, vapor deposition carbon atoms are used for repairing the defects of the graphite surface net, and on the other hand, the density of the graphene film is enhanced, that is, the graphene film with ultrahigh heat conductivity is obtained from the completeness of the volume density and the graphite crystal. According to the graphene film obtained by the method, the volume density is 1.8-2.2 g/cm < 3 >, and the thermal diffusion coefficient can reach 914.3-1071.5 mm < 2 >/s. Correspondingly, the thermal conductivity of the graphene in the plane direction can reach 1168.5-1637.7 W/mK. The graphene film obtained by the method has fewer pores and high compactness, so that the graphene film has higher thermal conductivity. The graphene film can be used in the fields of transverse temperature equalization of electronic equipment.
本发明公开了一种超高导热石墨烯膜的制备方法，首先将氧化石墨烯组装成膜，然后将其热还原移除非碳原子，与此同时，在热还原的过程中，同步使用化学气相沉积技术对氧化石墨烯膜进行改性，一方面利用气相沉积的碳原子修补石墨面网的缺陷，另一方面增强石墨烯膜的密度。即从体积密度和石墨晶体的完善性着手，进而获得超高导热石墨烯膜。本方法所得的石墨烯膜，体积密度为1.8～2.2g/cm3，热扩散系数则可达914.3～1071.5mm2/s。相应地，石墨烯平面方向上热导率可达1168.5～1637.7W/mK。本发明所得的石墨烯薄膜的孔隙较少，致密性高，因此具有较高的热导率。可用于电子设备的横向均温等领域。
Preparation method of graphene film with ultrahigh thermal conductivity
一种超高导热石墨烯膜的制备方法
LIU ZHANJUN (author) / TAO ZECHAO (author) / CHEN CHENGMENG (author) / KONG QINGQIANG (author)
2021-09-07
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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