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A platform for research: civil engineering, architecture and urbanism
Rapid treatment method for plate bottom void in narrow area of red clayed soil factory
The invention discloses a rapid treatment method for plate bottom void in a narrow area of a red clayed soil factory. The rapid treatment method for the plate bottom void in the narrow area of the red clayed soil factory comprises the following steps that (1) a grouting hole is drilled: the grouting hole is drilled in a void area, a distance between the position of the grouting hole and a slab joint is greater than 50cm, and the depth of the grouting hole is 0.8-1.2 m; (2) underground water is pumped: the underground water is pumped continuously until the ground is dry and no underground water seeps; (3) quick-setting concrete is sprayed, wherein the quick-setting concrete is evenly sprayed to a void part so that a water-resisting layer and a primary support can be formed as soon as possible; (4) grouting is conducted, specifically, the grouting is conducted in sequence from the position where cement concrete sinks greatly to the void part from large to small through the grouting holes, and when cement paste overflows from other holes or from side seams, cracks and the like, it is considered that the grouting is full; and (5) the grouting hole is plugged and cured: after the grouting is finished, the grouting hole is sealed by using a concrete core block and cured for 3-7 days to finish construction. According to the rapid treatment method for the plate bottom void in the narrow area of the red clayed soil factory, the method is simple, construction operation face is small, and maintenance speed is high.
本发明公开了一种红色粘性土壤厂区狭窄区域板底脱空的快速处理方法，包括以下步骤：1）钻设压浆孔：对存在脱空的区域钻压浆孔，压浆孔的位置距离板缝大于50cm，孔深0.8‑1.2米；2）抽除地下水：连续不断抽除地下水，直至地面干燥无地下水渗出为止；3）喷射速凝混凝土：在脱空部位均匀喷射速凝混凝土，以尽快形成隔水层和初期支护；4）压浆：从水泥混凝土沉陷大的地方开始，由大到小通过压浆孔往脱空部位依次进行注浆，当水泥浆从其他孔溢出或从边缝、裂缝等处溢出时，认为压浆压满；5）压浆孔封堵及养生：压浆结束后用混凝土芯块将压浆孔封严，养生3‑7天后即完成施工。本发明方法简单，施工作业面小，维修速度快。
Rapid treatment method for plate bottom void in narrow area of red clayed soil factory
The invention discloses a rapid treatment method for plate bottom void in a narrow area of a red clayed soil factory. The rapid treatment method for the plate bottom void in the narrow area of the red clayed soil factory comprises the following steps that (1) a grouting hole is drilled: the grouting hole is drilled in a void area, a distance between the position of the grouting hole and a slab joint is greater than 50cm, and the depth of the grouting hole is 0.8-1.2 m; (2) underground water is pumped: the underground water is pumped continuously until the ground is dry and no underground water seeps; (3) quick-setting concrete is sprayed, wherein the quick-setting concrete is evenly sprayed to a void part so that a water-resisting layer and a primary support can be formed as soon as possible; (4) grouting is conducted, specifically, the grouting is conducted in sequence from the position where cement concrete sinks greatly to the void part from large to small through the grouting holes, and when cement paste overflows from other holes or from side seams, cracks and the like, it is considered that the grouting is full; and (5) the grouting hole is plugged and cured: after the grouting is finished, the grouting hole is sealed by using a concrete core block and cured for 3-7 days to finish construction. According to the rapid treatment method for the plate bottom void in the narrow area of the red clayed soil factory, the method is simple, construction operation face is small, and maintenance speed is high.
本发明公开了一种红色粘性土壤厂区狭窄区域板底脱空的快速处理方法，包括以下步骤：1）钻设压浆孔：对存在脱空的区域钻压浆孔，压浆孔的位置距离板缝大于50cm，孔深0.8‑1.2米；2）抽除地下水：连续不断抽除地下水，直至地面干燥无地下水渗出为止；3）喷射速凝混凝土：在脱空部位均匀喷射速凝混凝土，以尽快形成隔水层和初期支护；4）压浆：从水泥混凝土沉陷大的地方开始，由大到小通过压浆孔往脱空部位依次进行注浆，当水泥浆从其他孔溢出或从边缝、裂缝等处溢出时，认为压浆压满；5）压浆孔封堵及养生：压浆结束后用混凝土芯块将压浆孔封严，养生3‑7天后即完成施工。本发明方法简单，施工作业面小，维修速度快。
Rapid treatment method for plate bottom void in narrow area of red clayed soil factory
一种红色粘性土壤厂区狭窄区域板底脱空的快速处理方法
ZHANG MING (author) / DENG HONGDA (author) / XIE XIAOKUN (author) / WANG XINGMIN (author) / LI JING (author)
2021-09-14
Patent
Electronic Resource
Chinese
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