A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Shell assembly, preparation method thereof and electronic equipment
The invention discloses a shell assembly, a preparation method thereof and electronic equipment. The method comprises the following steps: preparing a ceramic body; carrying out hot bending treatment on the ceramic green body to obtain a ceramic matrix with a 2.5 D structure or a 3D structure; and forming a plastic layer on the first surface of the ceramic substrate to obtain the shell assembly. Therefore, the ceramic body is subjected to hot bending treatment to form the ceramic substrate with the 2.5 D structure or the 3D structure, so that the formation of internal stress in a CNC (Computer Numerical Control) machining method can be avoided, stress release which is difficult to control cannot occur in the subsequent machining process, and a connecting line generated by polishing treatment on a ceramic plane and CNC machining on a cambered surface cannot occur; the outer surface of the shell assembly prepared by using the method provided by the invention has the texture of ceramic being gentle as jade, and the plastic layer is arranged on the inner surface of the ceramic substrate, so that a weight reduction effect can be achieved on the basis of not reducing other properties of the shell assembly.
本申请公开了壳体组件及其制备方法和电子设备。该方法包括：制备陶瓷坯体；对所述陶瓷坯体进行热弯处理，得到2.5D结构或3D结构的陶瓷基体；在所述陶瓷基体的第一表面形成塑胶层，得到所述壳体组件。由此，采用热弯处理陶瓷坯体以形成2.5D结构或3D结构的陶瓷基体，可以避免CNC加工方法中内应力的形成，后续加工过程中也不会出现难以控制的应力释放，并且不会出现对陶瓷平面进行抛光处理、弧面进行CNC加工产生的交接线，利用本申请提出的方法制备的壳体组件外表面具有陶瓷温润如玉的质感，并且在陶瓷基体的内表面设置了塑胶层，可以在不降低壳体组件其他性能的基础上起到减重的作用。
Shell assembly, preparation method thereof and electronic equipment
The invention discloses a shell assembly, a preparation method thereof and electronic equipment. The method comprises the following steps: preparing a ceramic body; carrying out hot bending treatment on the ceramic green body to obtain a ceramic matrix with a 2.5 D structure or a 3D structure; and forming a plastic layer on the first surface of the ceramic substrate to obtain the shell assembly. Therefore, the ceramic body is subjected to hot bending treatment to form the ceramic substrate with the 2.5 D structure or the 3D structure, so that the formation of internal stress in a CNC (Computer Numerical Control) machining method can be avoided, stress release which is difficult to control cannot occur in the subsequent machining process, and a connecting line generated by polishing treatment on a ceramic plane and CNC machining on a cambered surface cannot occur; the outer surface of the shell assembly prepared by using the method provided by the invention has the texture of ceramic being gentle as jade, and the plastic layer is arranged on the inner surface of the ceramic substrate, so that a weight reduction effect can be achieved on the basis of not reducing other properties of the shell assembly.
本申请公开了壳体组件及其制备方法和电子设备。该方法包括：制备陶瓷坯体；对所述陶瓷坯体进行热弯处理，得到2.5D结构或3D结构的陶瓷基体；在所述陶瓷基体的第一表面形成塑胶层，得到所述壳体组件。由此，采用热弯处理陶瓷坯体以形成2.5D结构或3D结构的陶瓷基体，可以避免CNC加工方法中内应力的形成，后续加工过程中也不会出现难以控制的应力释放，并且不会出现对陶瓷平面进行抛光处理、弧面进行CNC加工产生的交接线，利用本申请提出的方法制备的壳体组件外表面具有陶瓷温润如玉的质感，并且在陶瓷基体的内表面设置了塑胶层，可以在不降低壳体组件其他性能的基础上起到减重的作用。
Shell assembly, preparation method thereof and electronic equipment
壳体组件及其制备方法和电子设备
KANG ZHANBO (author)
2022-05-13
Patent
Electronic Resource
Chinese
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